Thank you for taking interest in the Mmi Amd part number 5330-1F883C, a Microcircuit Memory product that we stock that is presented alongside the NSN 5962-01-310-8696 for ease of identification. If you would like to learn more about this component and secure purchasing options for your consideration, please fill out and submit the Request for Quote (RFQ) form that is offered below. All we ask is that you supply us with enough information to best accommodate any particular requirements or restrictions that you may have, and we will respond with a curated quote within 15 minutes of our receipt and review.
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We strive to ensure that customers only receive precise items of need, opting to arrange our collection by diverse, commonly recognized forms of data. For instance, part number 5330-1F883C specifically traces back to Mmi Amd through the CAGE Code 50364, a distinct identifier for one of their physical locations. Moreover, with the NSN 5962-01-310-8696, this listing falls within Federal Supply Code (FSC) 5962 Microcircuits Electronic, enabling one to figure out its basic application. Keeping this in mind, do not hesitate to obtain a competitive quote for part number 5330-1F883C here on Aero OEM Parts at your earliest convenience.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-310-8696 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013108696 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
ROM/PROM FAMILY 022 | 2 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.285 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 332.8 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND W/OPEN COLLECTOR AND BIPOLAR AND PROGRAMMABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-5 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
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