Thank you for taking interest in the Intel Corporation part number C11011, a Microcircuitmemory product that we stock that is presented alongside the NSN 5962-00-166-6256 for ease of identification. If you would like to learn more about this component and secure purchasing options for your consideration, please fill out and submit the Request for Quote (RFQ) form that is offered below. All we ask is that you supply us with enough information to best accommodate any particular requirements or restrictions that you may have, and we will respond with a curated quote within 15 minutes of our receipt and review.
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We strive to ensure that customers only receive precise items of need, opting to arrange our collection by diverse, commonly recognized forms of data. For instance, part number C11011 specifically traces back to Intel Corporation through the CAGE Code 34649, a distinct identifier for one of their physical locations. Moreover, with the NSN 5962-00-166-6256, this listing falls within Federal Supply Code (FSC) 5962 Microcircuits Electronic, enabling one to figure out its basic application. Keeping this in mind, do not hesitate to obtain a competitive quote for part number C11011 here on Aero OEM Parts at your earliest convenience.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-00-166-6256 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 001666256 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| DMS 82108B | 1 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.735 INCHES MINIMUM AND 0.830 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.055 INCHES MINIMUM AND 0.125 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | 0.0/70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/160.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND LOW POWER AND 3-STATE OUTPUT AND WIRE-OR OUTPUTS AND EXPANDABLE AND W/DECODED OUTPUT AND W/BUFFERED OUTPUT AND W/STORAGE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -20.0 VOLTS MINIMUM POWER SOURCE AND 5.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 10.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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