Thank you for taking interest in the Integrated Device Technology Inc part number IDT72V36100, a Microcircuit Memory product that we stock that is presented alongside the NSN 5962-01-589-8596 for ease of identification. If you would like to learn more about this component and secure purchasing options for your consideration, please fill out and submit the Request for Quote (RFQ) form that is offered below. All we ask is that you supply us with enough information to best accommodate any particular requirements or restrictions that you may have, and we will respond with a curated quote within 15 minutes of our receipt and review.
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We strive to ensure that customers only receive precise items of need, opting to arrange our collection by diverse, commonly recognized forms of data. For instance, part number IDT72V36100 specifically traces back to Integrated Device Technology Inc through the CAGE Code 61772, a distinct identifier for one of their physical locations. Moreover, with the NSN 5962-01-589-8596, this listing falls within Federal Supply Code (FSC) 5962 Microcircuits Electronic, enabling one to figure out its basic application. Keeping this in mind, do not hesitate to obtain a competitive quote for part number IDT72V36100 here on Aero OEM Parts at your earliest convenience.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-589-8596 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 015898596 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| IDT72V36100L15PFI | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AFGA | Operating Temp Range | -40.0/+85.0 DEG CELSIUS |
| ADAU | Body Height | 1.6 MILLIMETERS MAXIMUM |
| CBBL | Features Provided | ASYNCHRONOUS AND SYNCHRONOUS AND PROGRAMMABLE AND HIGH PERFORMANCE |
| TTQY | Terminal Type And Quantity | 128 GULLWING |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CWSG | Terminal Surface Treatment | SOLDER |
| CQSZ | Inclosure Configuration | FLAT PACK |
| ABHP | Overall Length | 21.9 MILLIMETERS MINIMUM AND 22.1 MILLIMETERS MAXIMUM |
| ADAT | Body Width | 13.9 MILLIMETERS MINIMUM AND 14.1 MILLIMETERS MAXIMUM |
| CXCY | Part Name Assigned By Controlling Agency | 3.3 VOLT HIGH DENSITY SUPERSYNC II 36 BIT FIFO 65,536 X 36 |
| MRC | Decoded Requirement | Clear Text Reply |
| ADAQ | Body Length | 19.9 MILLIMETERS MINIMUM AND 20.1 MILLIMETERS MAXIMUM |
| CTFT | Case Outline Source And Designator | MS-026BHB JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CQSJ | Inclosure Material | PLASTIC |
| ABMK | Overall Width | 15.9 MILLIMETERS MINIMUM AND 16.1 MILLIMETERS MAXIMUM |
| CZEQ | Time Rating Per Chacteristic | 15.00 NANOSECONDS NOMINAL ACCESS |
| CZEN | Voltage Rating And Type Per Characteristic | 3.3 VOLTS NOMINAL INPUT |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZER | Memory Device Type | FIRST-IN FIRST-OUT |
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